Heat treatment jig for semiconductor substrate
US7329947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2004 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Nov 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that holds the first jig and is mounted on a heat treatment boat is adopted as a heat treatment boat of a vertical heat treatment furnace, the stress concentrated during the heat treatment on a particular portion of the semiconductor substrate can be reduced; in the case of a semiconductor substrate large in the tare stress and having an outer shape of 300 mm being heat treated, or even in the case of the heat treatment being carried out under very high temperature conditions, the slips can be suppressed from occurring. The present invention can be widely applied as a stable heat treatment method of semiconductor substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.