Method and manufacturing surface acoustic wave device
US7331092B2 · kind B2 · utility
27Cited by
4References
3Claims
0Family size
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Key dates
| Filing date | Mar 23, 2004 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Jul 20, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a surface acoustic device that has a surface acoustic wave filter including comb-like electrodes, electrode pads, and wiring patterns formed on a joined substrate produced by joining a piezoelectric substrate and a supporting substrate to each other. This method includes the steps of: activating at least one of the joining surfaces of the piezoelectric substrate and the supporting substrate; and joining the piezoelectric substrate and the supporting substrate in such a manner that the activated joining surfaces face each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.