Electroplating tool for semiconductor manufacture having electric field control
US7332062B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2003 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Mar 4, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating tool for providing a metal or metal film on a semiconductor wafer during processing thereof has a wafer chucking mechanism with a conductor or conductors associated therewith. The conductor(s) are electrically connected to a controller that applies a voltage or current applied thereto for altering the position of and/or varying the intensity of electromagnetic field lines originating from a source anode of the electroplating tool. The electromagnetic field lines originating from the source anode direct the deposition of metal from the electroplating solution to the semiconductor wafer. The conductor(s) of the wafer chucking mechanism improve and/or modulate the electromagnetic field lines of the electroplating process. This provides greater control of metal deposition during the electroplating process such that uniformity of the metal (e.g. copper) is provided across the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.