Soldering a die to a substrate
US7332423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Feb 26, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.