Cooling plate, bake unit, and substrate treating apparatus
US7332691B2 · kind B2 · utility
7Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Mar 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the cooling plate to communicate with the exterior. Thus, an inner pressure of the space is maintained to be equal to an outer pressure thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.