Probe card and method for constructing same
US7332921B2 · kind B2 · utility
6Cited by
25References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Mar 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.