Substrate processing apparatus and substrate handling method
US7335090B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2007 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Feb 27, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for transferring a substrate between the substrate holding mechanism and the carrier held by the carrier holding unit. The substrate holding mechanism has a first substrate contacting member which comes in contact with the substrate when the substrate holding mechanism holds the substrate, and at least the substrate contacting portion of the first substrate contacting member includes a conductive portion, which is electrically grounded. The substrate transfer mechanism has a second substrate contacting member which comes in contact with the substrate when the substrate transfer mechanism transfers the substrate, and at least the substrate contacting portion of the second substrate contacting member includes a conductive portion, which is electrically grounded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.