Single-layer polishing pad and method of producing the same
US7335094B2 · kind B2 · utility
1Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2006 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Jul 22, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.