High purity electrolytic copper and its production method
US7335289B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Aug 11, 2004 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Feb 8, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25C5/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of producing high purity electrolytic copper through halide-bath electrowinning is provided. The method includes the steps of: growing copper in dendritic form to be deposited on a cathode; and recovering growth ends of 3.0 mm or shorter from the dendrites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.