Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7335396B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2003 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Mar 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/7761
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods, apparatuses, and systems for controlling mass flow rates and pressures in passageways coupled to reaction chambers are disclosed herein. In one embodiment, a method includes controlling a mass flow rate in a passageway in response to a first condition by modulating a valve of a mass flow and pressure control unit, and controlling a pressure in the passageway in response to a second condition different than the first condition by modulating the valve of the mass flow and pressure control unit. In another embodiment, an apparatus includes a mass flow measurement device, a pressure sensor, a modulating valve in the passageway, and a controller operably coupled to the mass flow measurement device, the pressure sensor, and the modulating valve. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.