Process for manufacturing a light-emitting device
US7335523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2006 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Aug 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device comprising a light-emitting unit including a plurality of first connecting pads, a base substrate including a plurality of second connecting pads, and a plurality of conductive bumps that connect the first connecting pads of the light-emitting unit to the second connecting pads of the base substrate. In the manufacturing process, a reflow process is performed to bond the conductive bumps to the first and second connecting pads. The light-emitting unit is configured to emit a first light radiation upon the application of an electric current flow, and the base substrate is configured to emit a second light radiation when stimulated by the first light radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.