Method of processing an object and method of controlling processing apparatus to prevent contamination of the object
US7335601B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2005 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Nov 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture includes processing an object in a chamber and subsequently generating an electrical force of attraction to float contaminants off of a region adjacent the processed object before the object is unloaded from the chamber. The object may be processed with the use of plasma. The plasma is produced by introducing a first gas into the chamber and applying a source power to the first gas. The plasma is extinguished after the object is processed with the use of the plasma. Then, a second gas is introduced into the chamber and a source power is applied to the second gas to generate the electrical force of attraction. At this time, the parameters are controlled so that particle contaminants are readily removed without any influence on the object. Also, the same electrode can be used to apply source power to both the first and second gas. Thus, the operation of removing the particle contaminants is relatively simple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.