Device and method for tilted land grid array interconnects on a coreless substrate package
US7335979B2 · kind B2 · utility
2Cited by
14References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10719
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An article of manufacture and system, as well as fabrication methods therefore, may include a plurality of lands disposed on a surface of a substrate wherein the lands are oriented at an angle to the surface of the substrate and further wherein the substrate is formed of conductive layers that are formed such that a non-conductive layer does not interpose between the conductive layers and their coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.