Patent · US Expired

Chip card module

US7337967B2 · kind B2 · utility

2Cited by

2References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bettina Latka · Hemau, DE
Frank Puschner · Kelheim, DE
Wolfgang Schindler · Graz, AT
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	Nov 28, 2005
Grant date	Mar 4, 2008
Priority date	—
Expiry date	Nov 28, 2025

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/14
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A chip card module having a carrier with contact areas. Arranged on the carrier lying opposite the contact areas is a semiconductor chip, which has an integrated circuit which has on a surface of the chip terminal contacts which are connected in an electrically conducting manner to assigned contact areas. The contact areas have a first conducting layer and a second conducting layer, with cluster elements embedded in the second conducting layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.