Lead-free solder alloy
US7338567B2 · kind B2 · utility
11Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Dec 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.