Resin-encapsulation semiconductor device and method for fabricating the same
US7338838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Jun 7, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.