Process for exposing solder bumps on an underfill coated semiconductor
US7338842B2 · kind B2 · utility
6Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | May 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and removing the compliant surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.