Heat sink module for dissipating heat from a heat source on a motherboard
US7339787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2006 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Aug 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of the heat sink plate, the number of screws is reduced. Furthermore, the screws pass through the first lug of the heat sink plate and the second lug of the fan set, so that the heat sink plate and the fan set are fixed on the motherboard, and thereby the number of the parts to be fixed by screws is reduced. Heat from the heat source on the motherboard is conducted to the fan set to be dispersed through the heat sink plate extending to the heat source and covering the fan set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.