Cooling unit and flow distributing element for use in such unit
US7339788B2 · kind B2 · utility
18Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Mar 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.