Stress measuring method and system
US7342226B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 8, 2006 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Feb 8, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A convergent electron beam is incident on an evaluation region of a crystalline material to obtain a HOLZ pattern formed by the convergent electron beam transmitted to the crystalline material (Steps S11 to S13), a split width of the HOLZ line of the obtained HOLZ pattern is computed (Step S14), and a stress in the evaluation region of the crystalline material is evaluated based on the split width of the HOLZ line (Step S15). Thus, the stress measuring method and system can measure with good precision a local lattice strain amount and stress value of the crystalline material, and a stress value of a stress source applying a stress to the crystalline material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.