Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

US7342299B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Brian P. Gaucher · Brookfield, US
• Duixian Liu · Yorktown Heights, US
• Ullrich R. Pfeiffer · Wolfsburg, DE
• Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

• Filing date: Sep 21, 2005
• Grant date: Mar 11, 2008
• Expiry date: Sep 21, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30111
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.