Multi-chip package with high-speed serial communications between semiconductor die
US7342310B2 · kind B2 · utility
1Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2004 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Oct 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.