Revathi Uma Polisetti
2Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: May 7, 2004 → Jan 10, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7537960B2 | Method of making multi-chip package with high-speed serial communications between semiconductor dice | Electricity | 2 | Active |
| US7342310B2 | Multi-chip package with high-speed serial communications between semiconductor die | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.