Patent · US Expired

Method of manufacturing reliability checking and verification for lithography process using a calibrated eigen decomposition model

US7342646B2 · kind B2 · utility

16Cited by
14References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 27, 2005
Grant dateMar 11, 2008
Priority date
Expiry dateMay 19, 2025

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P90/02
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method for modeling a photolithography process which includes the steps of generating a calibrated model of the photolithography process capable of estimating an image to be produced by the photolithography process when utilized to image a mask pattern containing a plurality features; and determining an operational window of the calibrated model, which defines whether or not the calibrated model can accurately estimate the image to be produced by a given feature in the mask pattern.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.