Topographically defined thin film CPP read head fabrication
US7344330B2 · kind B2 · utility
2Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49048
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of constructing a small trackwidth magnetorsesistive sensor by defining a trench between first and second hard bias layers and depositing the sensor into the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.