Gassing-free exposure mask
US7344807B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 12, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Jul 7, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/64
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to an exposure mask for structuring a photoresist layer on a substrate wafer, in which an inorganic adhesive is used as an adhesive device for connecting a reticle having a lithographic structure, a frame and a pellicle. For chemical reasons, an adhesive of this type has no tendency or a considerably lower tendency to gassing out than an organic adhesive used in conventional exposure masks, so that the risk of particles which are deposited on the lithographic structure and which can cause projection errors during an exposure process is largely ruled out. The invention relates further to a method of producing such an inorganic adhesive and also a method of producing an exposure mask with the aid of such an inorganic adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.