Method of manufacturing substrate for circuit board and smart label having the substrate
US7345645B2 · kind B2 · utility
10Cited by
2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Jul 23, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.