Se-hoon Cho
13Patents
5h-index
5Co-inventors
51Inventor score
Filing activity: Jul 26, 2004 → Jun 17, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7889037B2 | Magnetic levitation sliding structure | Electricity | 40 | Active |
| US7831286B2 | Sliding structure for electronic device | Electricity | 26 | Active |
| US7231236B2 | Integrated antenna and input/output port for a wireless communication device | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7345645B2 | Method of manufacturing substrate for circuit board and smart label having the substrate | Emerging Cross-Sectional Technologies | 10 | Expired |
| US8419880B2 | Method of transferring graphene | Performing Operations; Transporting | 6 | Active |
| US7374342B2 | Hydrodynamic fluid film bearing and bearing housing with cooling capacity | Mechanical Engineering; Lighting; Heating | 5 | Expired |
| US7540663B2 | Hydrodynamic fluid film bearing and bearing housing with cooling capacity | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US7070114B2 | Smart label and manufacturing method thereof | Physics | 3 | Expired |
| US7952175B2 | Lead frame, semiconductor package including the lead frame and method of forming the lead frame | Emerging Cross-Sectional Technologies | 3 | Active |
| US8019397B2 | Magnetic levitation sliding structure | Electricity | 2 | Active |
| US7907980B2 | Magnetic levitation sliding structure | Electricity | 2 | Active |
| US7995100B2 | Apparatus for controlling specific function and camera module having the same | Electricity | 0 | Active |
| US7341889B2 | Lead frame for semiconductor package and method of fabricating semiconductor package | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.