Non-influencing fastener for mounting a heat sink in contact with an electronic component
US7345881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2006 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Jun 21, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.