John L. Colbert
42Patents
12h-index
46Co-inventors
77Inventor score
Filing activity: Oct 10, 1997 → Jun 5, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6480391B1 | Modular cage for an electronic component | Electricity | 54 | Expired |
| US6385044B1 | Heat pipe heat sink assembly for cooling semiconductor chips | Electricity | 37 | Expired |
| US5947570A | Modular cabinet assembly for a computer | Physics | 36 | Expired |
| US6475011B1 | Land grid array socket actuation hardware for MCM applications | Electricity | 24 | Expired |
| US6449155B1 | Land grid array subassembly for multichip modules | Electricity | 22 | Expired |
| US7499279B2 | Cold plate stability | Electricity | 21 | Active |
| US7751918B2 | Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates | Physics | 20 | Active |
| US7486516B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 18 | Active |
| US8267701B2 | Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing | Electricity | 17 | Active |
| US7777329B2 | Heatsink apparatus for applying a specified compressive force to an integrated circuit device | Electricity | 16 | Active |
| US5928016A | Direct access storage device housing and tray design | Electricity | 15 | Expired |
| US7435622B2 | High performance reworkable heatsink and packaging structure with solder release layer and method of making | Electricity | 13 | Active |
| US7342306B2 | High performance reworkable heatsink and packaging structure with solder release layer | Electricity | 12 | Expired |
| US7606033B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 11 | Active |
| US7293994B2 | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7345881B2 | Non-influencing fastener for mounting a heat sink in contact with an electronic component | Emerging Cross-Sectional Technologies | 10 | Active |
| US6561554B2 | Simplified latch and associated assembly method | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6634095B2 | Apparatus for mounting a land grid array module | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6757965B2 | Method of installing a land grid array multi-chip modules | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6089917A | Method and system for circuit board common mode noise suppression utilizing ferrous cores | Electricity | 8 | Expired |
| US7903411B2 | Cold plate stability | Electricity | 7 | Active |
| US6988533B2 | Method and apparatus for mounting a heat transfer apparatus upon an electronic component | Electricity | 5 | Expired |
| US8363404B2 | Implementing loading and heat removal for hub module assembly | Electricity | 5 | Active |
| US7944698B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 4 | Active |
| US6802733B2 | Topside installation apparatus for land grid array modules | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.