Metallic solder thermal interface material layer and application of the same
US7347354B2 · kind B2 · utility
14Cited by
15References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2004 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Oct 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.