Chris Rumer
4Patents
3h-index
11Co-inventors
43Inventor score
Filing activity: Dec 29, 2000 → Jun 29, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7347354B2 | Metallic solder thermal interface material layer and application of the same | Electricity | 14 | Expired |
| US6974726B2 | Silicon wafer with soluble protective coating | Electricity | 13 | Expired |
| US7220624B2 | Windowed package for electronic circuitry | Electricity | 5 | Expired |
| US7242088B2 | IC package pressure release apparatus and method | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.