Rework process for removing residual UV adhesive from C4 wafer surfaces
US7348216B2 · kind B2 · utility
1Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Apr 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.