Steven R. Codding
11Patents
4h-index
18Co-inventors
49Inventor score
Filing activity: Aug 29, 2003 → Oct 21, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7932614B2 | Method of thinning a semiconductor substrate | Electricity | 8 | Active |
| US7025891B2 | Method of polishing C4 molybdenum masks to remove molybdenum peaks | Chemistry; Metallurgy | 6 | Expired |
| US7387911B2 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking | Electricity | 5 | Expired |
| US7867876B2 | Method of thinning a semiconductor substrate | Electricity | 5 | Active |
| US7498236B2 | Silicon wafer thinning end point method | Electricity | 2 | Active |
| US7348216B2 | Rework process for removing residual UV adhesive from C4 wafer surfaces | Electricity | 1 | Expired |
| US7572739B2 | Tape removal in semiconductor structure fabrication | Electricity | 1 | Active |
| US7732303B2 | Method for recycling of ion implantation monitor wafers | Electricity | 1 | Active |
| US7700488B2 | Recycling of ion implantation monitor wafers | Electricity | 1 | Active |
| US8034718B2 | Method to recover patterned semiconductor wafers for rework | Electricity | 0 | Active |
| US7666689B2 | Method to remove circuit patterns from a wafer | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.