Method for fabricating module of semiconductor chip
US7348262B2 · kind B2 · utility
4Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Mar 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a module of a semiconductor chip is provided. The method includes the steps of: forming a bump on a substrate provided with a pad; forming a protection layer over the bump; performing a grinding process on a rear surface of the substrate to reduce a thickness of the substrate; and exposing the bump by removing the protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.