Apparatus for performing high frequency electronic package testing
US7348597B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Mar 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC, coupled to the interface structure for providing circuit connections, and a fixture board, coupled to the interface structure, wherein at least one of the fixture board and mock-up IC includes high frequency probe pads for providing a signal and ground point for high bandwidth test probing. Raw measurements are used for validation of the electronic package specifications when adequate test fixture bandwidth is available or included into circuit simulations models when a minimal phase error is acceptable, else phase and loss corrections are applied to the measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.