Integrated circuit package to provide high-bandwidth communication among multiple dice
US7348678B2 · kind B2 · utility
1Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | May 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15312
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.