Qing Zhou
12Patents
3h-index
12Co-inventors
53Inventor score
Filing activity: Oct 13, 2005 → Apr 11, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7432592B2 | Integrated micro-channels for 3D through silicon architectures | Electricity | 267 | Expired |
| US7554203B2 | Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture | Electricity | 57 | Active |
| US8012808B2 | Integrated micro-channels for 3D through silicon architectures | Electricity | 15 | Active |
| US7564066B2 | Multi-chip assembly with optically coupled die | Electricity | 3 | Active |
| US7939922B2 | Forming compliant contact pads for semiconductor packages | Electricity | 3 | Active |
| US8189361B2 | Multi-chip assembly with optically coupled die | Electricity | 2 | Active |
| US7851809B2 | Multi-chip assembly with optically coupled die | Electricity | 1 | Active |
| US7348678B2 | Integrated circuit package to provide high-bandwidth communication among multiple dice | Electricity | 1 | Expired |
| US8148805B2 | Forming compliant contact pads for semiconductor packages | Electricity | 0 | Active |
| US7538019B2 | Forming compliant contact pads for semiconductor packages | Electricity | 0 | Expired |
| US7980865B2 | Substrate with raised edge pads | Emerging Cross-Sectional Technologies | 0 | Expired |
| US11851966B1 | Horizontal sampling soil drilling rig and control method thereof | Fixed Constructions | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.