Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
US7348786B2 · kind B2 · utility
21Cited by
63References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Oct 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative to test at least one signal of at least one optoelectronic device under test. The probe substrate is operative to interface with electrical and optical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.