Inventor · San Diego, CA, US

Hiren D. Thacker

28Patents
13h-index
30Co-inventors
77Inventor score

Filing activity: Mar 17, 2003 → Feb 6, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US8742576B2 Maintaining alignment in a multi-chip module using a compressible structure Electricity 63 Active
US8971676B1 Hybrid-integrated photonic chip package Electricity 41 Active
US9297971B2 Hybrid-integrated photonic chip package with an interposer Electricity 35 Active
US8548287B2 Direct interlayer optical coupler Emerging Cross-Sectional Technologies 27 Active
US7348786B2 Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication Physics 21 Expired
US9256026B2 Hybrid integrated photonic chip package Electricity 19 Active
US9142698B1 Integrated electro-absorption modulator Emerging Cross-Sectional Technologies 17 Active
US9159861B2 Method for singulating hybrid integrated photonic chips Electricity 16 Active
US9217836B2 Edge coupling of optical devices Physics 15 Active
US9250403B2 Hybrid-integrated photonic chip package with an interposer Electricity 15 Active
US9678271B2 Packaged opto-electronic module Electricity 14 Active
US8188581B2 Mechanical coupling in a multi-chip module using magnetic components Electricity 14 Active
US8548288B2 Efficient inter-chip optical coupling Physics 13 Active
US9933574B1 Waveguide-last silicon photonic optical connector assembly Physics 10 Active
US8772920B2 Interconnection and assembly of three-dimensional chip packages Electricity 10 Active
US9411177B2 Integrated electro-absorption modulator Emerging Cross-Sectional Technologies 10 Active
US9082808B2 Batch process for three-dimensional integration Electricity 5 Active
US8998509B2 Stackable photonic interconnect module Physics 4 Active
US7554347B2 High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Physics 3 Expired
US9819421B1 Extracting an embedded DC signal to provide a reference voltage for an optical receiver Electricity 2 Active
US8648463B2 Assembly of multi-chip modules with proximity connectors using reflowable features Electricity 2 Active
US8334149B2 Mechanical coupling in a multi-chip module using magnetic components Electricity 1 Active
US8600201B2 Optical device with enhanced mechanical strength Physics 1 Active
US8975754B2 Chip package for high-count chip stacks Electricity 1 Active
US8315065B2 Self-locking features in a multi-chip module Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.