Enhanced compliant probe card systems having improved planarity

US7349223B2 · kind B2 · utility

Assignee

• Nanonexus, Inc. · US

Inventors

• Joseph Haemer · San Jose, US
• Fu Chiung Chong · Saratoga, US
• Douglas N. Modlin · San Mateo, US

Key dates

• Filing date: Jun 16, 2004
• Grant date: Mar 25, 2008
• Expiry date: Jul 20, 2025

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49004
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a stiffening structure and a compliant carrier structure, such as a decal or screen, which is fixedly attached to the probe chip substrate.