Sensor chip breaking strength inspection apparatus and sensor chip breaking strength inspection method
US7350406B2 · kind B2 · utility
2Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Apr 13, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0647
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.