Multi-layer film packaging of hot melt adhesive
US7350644B2 · kind B2 · utility
3Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2002 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Jul 31, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B9/20
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.