Leisa Ryan
3Patents
2h-index
6Co-inventors
33Inventor score
Filing activity: Oct 18, 2002 → Mar 12, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7795336B2 | Low application temperature hot melt adhesive | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7350644B2 | Multi-layer film packaging of hot melt adhesive | Performing Operations; Transporting | 3 | Expired |
| US7683114B2 | Low application temperature hot melt adhesive | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.