Structure and method of forming capped chips
US7351641B2 · kind B2 · utility
7Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Sep 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1092
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.