Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
US7351662B2 · kind B2 · utility
6Cited by
8References
23Claims
0Family size
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Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Oct 2, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishing even though the slurry has low solids-content. The slurry comprises a bicarbonate salt, which acts as a catalyst for increasing removal rates of dielectric films during polishing of these substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.