Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
US7351915B2 · kind B2 · utility
14Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2004 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Nov 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.