Component mounting method
US7353596B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Oct 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53187
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.