Selective dry etching of tantalum and tantalum nitride
US7354853B2 · kind B2 · utility
1Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2005 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | May 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76865
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention describes a method for the selective dry etching of tantalum and tantalum nitride films. Tantalum nitride layers (30) are often used in semiconductor manufacturing. The semiconductor substrate is exposed to a reducing plasma chemistry which passivates any exposed copper (40). The tantalum or tantalum nitride films are selectively removed using an oxidizing plasma chemistry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.