Semiconductor device with stacked semiconductor chips of the same type
US7355272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2005 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Feb 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same type as the first semiconductor chip and is mounted face up on the first semiconductor chip such that the orientation of the arrangement of the pads is at 90° from that of the first semiconductor chip, a third semiconductor chip (e.g. microcomputer chip) disposed on the second semiconductor chip, wires, and a sealing medium. The wiring board has a plurality of common wiring patterns for electrically connecting first electrodes for the first semiconductor chip and second electrodes for the second semiconductor chip. The common wiring patterns can be disposed without crossing on the surface wire layer of the wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.